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Metadados

1. Identificação
Tipo de ReferênciaArtigo em Revista Científica (Journal Article)
Sitemtc-m21c.sid.inpe.br
Código do Detentorisadg {BR SPINPE} ibi 8JMKD3MGPCW/3DT298S
Identificador8JMKD3MGP3W34R/3SFSKRS
Repositóriosid.inpe.br/mtc-m21c/2019/01.02.10.07   (acesso restrito)
Última Atualização2019:01.04.11.13.39 (UTC) simone
Repositório de Metadadossid.inpe.br/mtc-m21c/2019/01.02.10.07.27
Última Atualização dos Metadados2021:02.11.18.10.48 (UTC) administrator
DOI10.1166/jon.2019.1563
ISSN2169-432X
Chave de CitaçãoRiehl:2019:ThEnUs
TítuloThermal enhancement using nanofluids on high heat dissipation electronic components
Ano2019
MêsJan.
Data de Acesso30 abr. 2024
Tipo de Trabalhojournal article
Tipo SecundárioPRE PI
Número de Arquivos1
Tamanho893 KiB
2. Contextualização
AutorRiehl, Roger Ribeiro
GrupoDIDMC-CGETE-INPE-MCTIC-GOV-BR
AfiliaçãoInstituto Nacional de Pesquisas Espaciais (INPE)
Endereço de e-Mail do Autorroger.riehl@inpe.br
RevistaJournal of Nanofluids
Volume8
Número1
Páginas30-40
Histórico (UTC)2019-01-02 10:09:15 :: simone :: 2018 -> 2019
2019-01-04 11:13:39 :: simone -> administrator :: 2019
2021-02-11 18:10:48 :: administrator -> simone :: 2019
3. Conteúdo e estrutura
É a matriz ou uma cópia?é a matriz
Estágio do Conteúdoconcluido
Transferível1
Tipo do ConteúdoExternal Contribution
Tipo de Versãopublisher
Palavras-ChaveThermal Enhancement
Electronics Cooling
Thermal Control
Pressure Drop
Nanofluids
ResumoThe paper deals with the development of a thermal management solution for a surveillance equipment, which needs to dissipate high levels of heat loads using both active and passive thermal control devices, that has been designed, simulated, built and tested in real operating conditions. The thermal management system was designed to use both a single-phase forced circulation loop and heat pipes using copper oxide (CuO)-water nanofluid, applied to promote the thermal management up to 50 kW of heat generated by several arrays of electronic components, being dissipated to the environment by a fan cooling system. The heat pipes collect the heat from electronic components that were far from the main single-phase forced circulation loop, rejecting the heat directly in its cold plates. Tests results of the thermal management system operating in real conditions show that with an addition of up to 20% by mass of CuO nanoparticles to the base fluid in the single-phase system, enhancements of up to 12% in the heat transfer coefficients were achieved but the increase in the pressure drop was around 32%. This shows that the use of nanofluid in the heat pipes resulted in a substantial decrease in the heat source temperature. When applying nanofluids in heat pipes, the maturity of this technology has reached Technology Readiness Level (TRL) of 8 for surveillance systems.
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4. Condições de acesso e uso
Idiomaen
Grupo de Usuáriossimone
Grupo de Leitoresadministrator
simone
Visibilidadeshown
Permissão de Leituradeny from all and allow from 150.163
Permissão de Atualizaçãonão transferida
5. Fontes relacionadas
Unidades Imediatamente Superiores8JMKD3MGPCW/446AF4B
Lista de Itens Citandosid.inpe.br/bibdigital/2021/02.11.18.06 4
DivulgaçãoWEBSCI; SCOPUS.
Acervo Hospedeirourlib.net/www/2017/11.22.19.04
6. Notas
Campos Vaziosalternatejournal archivingpolicy archivist callnumber copyholder copyright creatorhistory descriptionlevel e-mailaddress format isbn label lineage mark mirrorrepository nextedition notes orcid parameterlist parentrepositories previousedition previouslowerunit progress project resumeid rightsholder schedulinginformation secondarydate secondarykey secondarymark session shorttitle sponsor subject targetfile tertiarymark tertiarytype url
7. Controle da descrição
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